Extensive technology ecosystem partners demonstrate Marvell-powered products
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced that it will showcase its latest data center connectivity products and technologies powering the next wave of AI innovation at DesignCon 2026, February 24-26 at the Santa Clara Convention Center in Santa Clara, California.
The primary bottleneck in AI data center infrastructure is shifting from compute to connectivity. Data center operators need scalable, ultra-high performance connectivity solutions to handle the significant increase in new and more demanding AI workloads. To address this challenge, Marvell is driving advancements in interconnect technology at the package, server and rack levels, and working closely with an extensive partner ecosystem to deliver solutions that deliver superior bandwidth, power savings and performance at scale.
At DesignCon 2026, Marvell will introduce the latest advancements in its end-to-end data center connectivity portfolio. Marvell experts will review the latest in silicon, cabling, memory, and other technologies for advanced data center infrastructure in a diverse lineup of panels and presentations.
Additionally, Marvell will be displaying the following demonstrations at the DesignCon booth (#904):
- 40G die-to-die (D2D) interface for high bandwidth memory (HBM)
- 224G LR SerDes on Co-packaged Copper (CPC)
- 200G/lane active copper cable (ACC)
- PCIe 7.0 and PCIe 8.0 SerDes
- PCIe 6.0 Active Electrical Cable (AEC)
- 1.6T Active Electrical Cable (AEC)
Partner booth innovation
Ecosystem partners demonstrating interconnection solutions powered by Marvell include:
- Amphenol (Booths 833 and 1237)
- Foxconn Interconnect Technology (FIT) (Booth 719)
- Infraeo (Booth 760)
- Luxshare-Tech (Booth 839)
- Molex (Booth 739)
- Samtec (Booth 939)
- Senko (Booth 958)
- TE Connectivity (Booth 639)
- Tektronix (Booth 819)
- 3M (Booth 420)
About Marvel
To provide the data infrastructure technology that connects the world, we build our solutions on the strongest foundation: partnership with our customers. Trusted by the world’s leading technology companies for more than 30 years, we move, store, process and protect data around the world with semiconductor solutions designed for our customers’ current needs and future goals. Through a process of deep collaboration and transparency, we are ultimately changing the way tomorrow’s enterprise, cloud, and carrier architectures transform for the better.
Marvell and the M logo are trademarks of Marvell or its affiliates. For a complete list of Marvell trademarks, please visit www.marvell.com. Other names and brands may be claimed as the property of others.
This press release contains forward-looking statements within the meaning of federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statements that may predict, predict, suggest or imply future events, results or achievements. Actual events, results and achievements may differ materially from those contemplated in this press release. Forward-looking statements are predictions only and are subject to risks, uncertainties and assumptions that are difficult to predict. This includes those described in the “Risk Factors” section of our Annual Report on Form 10-K, Quarterly Reports on Form 10-Q and other documents we file with the SEC from time to time. Forward-looking statements speak only as of the date on which they are made. Readers are cautioned not to place undue reliance on forward-looking statements and no person undertakes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.
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Media contact:
george millington
pr@marvell.com
