The deep Shenzhen-based company plans to launch the Ascend 950PR early next year, launch the Ascend 950DT chip in late 2026, win the 960 in late 2027 and launch the Ascend 970 in late 2028.
[BEIJING] Huawei Technologies has announced the latest solutions to bundle more artificial intelligence (AI) chips together, increasing computing power to challenge Nvidia's technology.
The deep Shenzhen-based company's new Superpod Technology can support links for up to 15,488 graphics cards, including Huawei's Ascend branded AI chips, the company said Thursday (September 18).
The company said it now also has a supercluster with computing power, consisting of around 1 million graphics cards.
China has told the largest tech companies not to use NVIDIA's RTX Pro 6000D, a semiconductor for workstations that can be reused for AI applications. The move is Beijing's latest attempt to separate the country from Nvidia hardware, the gold standard in the AI industry, and is driving domestic alternatives.
Huawei's SuperPod solution appears to be an upgraded effort to compete with NVIDIA's NVLink products, which allow for high-speed communication between main chips within a server.
This technology is particularly important for Huawei's competition against Nvidia, as the Chinese company's most advanced upskills are less powerful than the cutting edge AI silicon of its US rivals.
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To compensate for the computing power offered by individual AI chips, Huawei is focusing on creating technologies that bundle more semiconductors together in clusters.
Earlier this year, Huawei founder Ren Zhengfei told the state newspapers People's daily Huawei still lags behind the US in terms of output from a single chip, but “compensating with cluster-based computing allows us to get the results we need.”
According to Chinese media, Huawei also announced a new lineup of AI chips to be released over the next three years at its company event on Thursday. The Ascend 950PR will be launched early next year and the Ascend 950DT chip will be released in the second half of 2026. The 960 will be ascended in the second half of 2027 and the 970 will be screened in the second half of 2028. Bloomberg
