Collaboration to accelerate commercialization of FotoNation’s ultra-low power sensor fusion SoC for edge AI applications
Galway, Ireland and Seoul, South Korea, May 11, 2026 /PRNewswire/ — FotoNation Ltd., a European-based perception and recognition company, and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement. Under the agreement, SEMIFIVE will lead the turnkey development of FotoNation’s ultra-low power perception AI chip family, TriSilica.
TriSilica is an ultra-low power, compact footprint sensory AI silicon platform designed to support multimodal sensor inputs including audio, mmWave, spectral, infrared, and RGB.
SemiFive Trisilica Logo
“FotoNation is a pioneer in in-device computational imaging solutions, and its Vision AI technology is redefining what’s possible at the edge,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “We are excited to bring FotoNation’s sophisticated TriSense IP core solution to high-performance silicon. This partnership strengthens SEMIFIVE’s technology leadership and serves as a strategic anchor for our expansion across the European semiconductor industry.”
This partnership is SEMIFIVE’s first European agreement and will expand its presence in the European market and further strengthen its footprint in the US, China, Japan and India. By leveraging our advanced semiconductor platform, SEMIFIVE continues to strengthen its position as the global partner of choice for innovators seeking high-performance custom AI. ASIC Solution.
The key to securing this project was SEMIFIVE’s actively developed expertise in highly complex, low power IC design and integrated packaging technology.
“Our partnership with SEMIFIVE and its custom semiconductor capabilities will be a core driver in the commercialization of FotoNation’s next generation of ultra-high performance, low-power sensor fusion SoCs,” said Petronel Bigioi, CEO of FotoNation. “We expect this partnership to be a major turning point in the advancement of image processing and sensor fusion technologies to meet the demands of the rapidly growing edge AI market.”
The first product, the TS-210, will be used in the multi-project wafer (MPW) shuttle scheduled for later this year. The target foundry process is Samsung Foundry’s 8nm Low Power Ultimate (8LPU) process.
About Photonation
FotoNation Ltd. is an Irish AI company headquartered in Galway with a development center in Brasov, Romania. FotoNation designs its silicon and IP with one mantra: remove unnecessary data before starting inference.
Its TriSense™ IP core integrates neural ISP, sensor fusion, and AI to enable perceptual cognition under extreme power constraints. The company’s TriSilica® chip family adds the industry’s first large-capacity bonded memory and transforms that architecture into high-volume silicon for devices that understand, adapt, and operate.
FotoNation’s technology is integrated into more than 4 billion products worldwide and powers dozens of top tape-outs across the consumer and edge AI markets. For more information, please visit www.fotonation.com.
About semi-five
SEMIFIVE Inc. (KOSDAQ: 490470) is a pioneer in platform-based SoC design, working with customers to implement innovative ideas into custom silicon in the most efficient manner. Our SoC platform provides a powerful starting point for new chip designs, leveraging configurable domain-specific architectures and pre-validated key IP pools. We deliver comprehensive spec-to-system capabilities in end-to-end solutions, allowing you to deliver custom SoCs faster while reducing cost and risk for key applications such as data center and AI-enabled IoT. With strong partnerships with Samsung Foundry and the larger ecosystem as a leading SAFE™ DSP partner, SEMIFIVE provides a one-stop-shop solution for all your SoC design needs. Click here for more information. www.semifive.com.
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Source FotoNation
