The latest technology in GF's embedded memory portfolio is now available for prototyping
At its annual technology summit in California, GlobalFoundries (NASDAQ:GFS) (GF) announced the availability of 22FDX+ with resistant RAM (RRAM) technology, indicating significant advances in the company's portfolio of embedded nonvolatile memory (ENVM) solutions. When combined with the high-performance Ultra-low Power22FDX® platform, the new RRAM technology provides secure, low latency, high density embedded memory for code storage in wireless microcontrollers and AI IoT applications.
Designed using industry-proven OxRAM technology, GF's built-in RRAM offers cost-effective memory with low power read/write, high durability and excellent retention. On-chip integration with GF's enhanced 22FDX platform improves data retention, reliability, security and power efficiency, creating compact, versatile system-on-chip (SOC) solutions for intelligently connected devices.
The high density and scalability of RRAM are ideal for AI-enabled IoT devices that rely on high-performance intelligence at the edge, such as sensors, wearables, and industrial systems. 22FDX+ RRAM also allows for heavy storage of neural networks that allow for more effective and complex networks.
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“We are pleased to announce that Ed Caste, Senior Vice President of GF's ultra-low power CMOS product line,” said: “Our latest solutions offer an attractive combination of density, performance and power efficiency, making them suitable to tackle the challenges of next-generation, AI-enabled, connected devices.”
“GlobalFoundries is a key partner at Nordic Semiconductor, pushing the boundaries of ultra-low power wireless solutions for next-generation connected products and AI-enabled devices.” “We welcome the deployment of GF's embedded RRAM as an important advancement that enables secure, scalable, and power-efficient edge intelligence. This type of innovation is delivered through a resilient global supply chain – essential to meeting the demand for performance, reliability and sustainability in connected systems.”
The macro pre-design kit for 22FDX+ RRAM is available through GF's self-service GF Connect portal and helps you jump through the design process. Volume production is scheduled for 2026, driven by several major customer engagements. Future generations of embedded RRAM technology and deployment to other platforms are under development.
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