- Unprecedented 7300+ core mark1 Dual arm CPU core included
- The TSMC 22Ull process delivers high performance and low power consumption
- Embedded MRAM with faster writing speeds and higher durability and retention
- Dedicated peripherals optimized for vision and voice AI plus real-time analysis
- The new AI software framework eases development and allows for easy migration with MPUs
- The latest security features ensure data privacy
Tokyo, Japan – Renesas Electronics Corporation (TSE:6723), the premier supplier of Advanced Semiconductor Solutions, today introduced a RA8P1 Microcontroller (MCU) group targeting artificial intelligence (AI) and machine learning (ML) applications, as well as real-time analytics. The new MCU establishes a new level of performance for the MCU by combining a 1GHz arm® cortex®-M85 and 250MHz cortex-M33 CPU core ARM ETHOS™-U55 Neural Machining Unit (NPU). This combination offers the highest CPU performance with over 7300 core marks and 256 GOP of AI performance at 500 MHz.
Designed for edge/endpoint AI
The RA8P1 is optimized for EDGE and endpoint AI applications to offload CPUs using ETHOS-U55 NPUs, providing up to 256 MAC with computationally intensive operations (CNNS and RNN) in convolutional and recurrent neural networks (CNNS and RNNS) delivering 256 GOPS performance at 500 MHz. The new NPU supports the most commonly used networks, such as DS-CNN, ResNet, and Mobilenet Tinyyolo. Depending on the neural network used, the Ethos-U55 offers up to 35 times more inference per second than the Cortex-M85 processor.
Advanced technology
The RA8P1 MCU is manufactured using TSMC's 22Ull (22nm ultra-low leakage) process, allowing for ultra-high performance with extremely low power consumption. This process also allows for the use of magnetic RAM (MRAM) embedded in the new MCU. Mram offers faster writing speeds and higher durability and retention compared to Flash.
“The demand for high-performance edge AIOT applications is explosively growing, and we are excited to showcase what we think is the best MCU to deal with this trend,” he said. Daryl Khoo, Vice President of Embedded Processing Marketing at Renesas. “The RA8P1 device demonstrates our technology and market expertise and highlights the strong partnerships we have built across the industry. Our customers want to adopt these new MCUs in multiple AI applications.”
“The pace of innovation in the AI era is faster than ever, and new edge use cases demand an extension of performance and machine learning,” he said. Paul Williamson, Senior Vice President and General Manager, IoT Sales Line Arm. “By building on the advanced AI capabilities of the ARM Compute Platform, Renesas' RA8P1 MCUs can help meet the demands of next-generation voice and vision applications and expand the intelligent, context-conscious AI experience.”
“It's great to see Renesas leverage the performance and reliability of TSMC 22Ull embedded MRAM technology to deliver outstanding results for the RA8P1 devices,” he said. Chien-Hsin Lee, Senior Director of Professional Technology Business Development at TSMC. “As TSMC continues to advance its embedded nonvolatile memory (ENVM) technology, we look forward to strengthening our longstanding collaboration with Renesas to drive innovation with future groundbreaking devices.”
Robust and optimized peripheral set for AI
Renesas has integrated dedicated peripherals, ample memory and advanced security to address voice and vision AI and real-time analytics applications. For Vision AI, it includes a 16-bit camera interface (CEU) that supports sensors up to 5 megapixels, enabling the camera and requesting a Vision AI application. The individual MIPI CSI-2 interfaces provide a low pin count interface with two lanes, up to 720Mbps each. Additionally, multiple audio interfaces including i2S and PDM support microphone input for audio AI applications.
The RA8P1 offers both on-chip and external memory options for efficient, low-latency neural network processing. The MCU contains 2MB SRAM for storing intermediate activations or graphics frame buffers. 1MB of on-chip MRAM can also be used for application code and storage for model weights or graphics assets. Large models can use high-speed external memory interfaces. SIP options with 4 or 8 MB external flash in one package are also available for more stringent AI applications.
New Ruhmi Framework
In addition to the RA8P1 MCU, Renesas has introduced Ruhmi (Renesas Unified Heterinous Model Integration), a comprehensive framework for MCUs and MPUs. Ruhmi efficiently deploys modern neural network models in the framework's agnostic way. It enables model optimization, quantization, graph compilation, and transformation, and generates efficient source code. Ruhmi provides native support for machine learning AI frameworks such as Tensorflow Lite, Pytorch, and Onnx. It also provides the necessary tools, APIs, code generators, and runtimes needed to deploy pre-trained neural networks, including out-of-the-box applications examples and models optimized for the RA8P1. Ruhmi is integrated with Renesas' own e2A studio IDE that enables seamless AI development. This integration promotes a common development platform for MCUs and MPUs.
Advanced security features
The RA8P1 MCU provides cutting-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous crypto accelerators that enhance RSAs up to Chacha20, ED25519, NIST ECC curve 521 bits, 4K, SHA2, SHA3. Cooperation with the Arm Trust Zone®This provides features like a comprehensive, fully integrated, secure element. The new MCU also offers powerful hardware root of trust and secure boot with first-stage bootloader (FSBL) for immutable storage. XSPI Interface On the Fly (DOTF) stores encrypted code images in an external flash and decrypts them on the fly as they are firmly transferred to the MCU for execution.
The solution is ready to use
Renesas offers a wide range of easy-to-use tools and solutions for the RA8P1 MCU, including Flexible Software Package (FSP), evaluation kits, and development tools. Like Zephyr, Freertos and Azure RTO are supported. Several Renesas software examples projects and application notes are available to bring faster time to the market. Additionally, numerous partner solutions are available to support development in the RA8P1 MCU, including nota.ai's driver monitoring solutions and Irida Lab's traffic/pedestrian monitoring solutions. Other solutions can be found on the Renesas RA Partner Ecosystem Solutions page.
Key Features of the RA8P1 MCU
- Processor: 1GHz ARM Cortex-M85, 500MHz ETHOS-U55, 250MHz ARM Cortex-M33 (optional)
- Memory: 1MB/512KB on-chip MRAM, 4MB/8MB external flash SIP option, 2MB SRAM full ECC protection, 32kb I/D per core per Caches
- Graphic peripherals:Graphics LCD controller that supports WXGA (1280×800), parallel RGB and MIPI-DSI display interfaces, powerful 2D drawing engines, parallel 16-bit CEU and MIPI CSI-2 camera interfaces, and resolutions up to 32-bit external memory bus (SDRAM and CSC) interfaces
- Other peripherals: Gigabit Ethernet and TSN Switches, XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI Audio Interface, 16-bit ADC with S/H Circuit, DAC, Comparison, Temperature Sensation, Timer, Timer, Timer, Timer, SSI Audio Audio Interface (Octal SPI)
- safety: Advanced RSIP-E50D Cryptographic Engine, TrustZone, Immutable Storage, Secure Boot, Tamper Resistance, DPA/SPA Attack Protection, Secure Debug, Secure Factory Programming, Device Lifecycle Management
- package: 224BGA, 289BGA
Winning combination
Renesas combined the new RA8P1 MCU with numerous compatible devices from its portfolio to offer a wide range of winning combinations, including video conferencing cameras with AI capabilities, AI drawing robot arms, and AI-enabled surveillance cameras. These designs are technically vetted systems architectures that work seamlessly from compatible devices to speed up optimized, low-risk designs to the market. Renesas offers a wide range of products and over 400 win combinations from the Renesas portfolio, enabling customers to speed up their design process and deliver their products to the market more quickly. You can find it at Renesas.com/win.
availability
The RA8P1 MCU is currently available. Renesas also ships the RA8P1 evaluation kit. For more information, please visit Renesas.com/ra8p1. Samples and kits can be ordered through the Renesas website or through the distributor.
Renesas MCU Leadership
Renesas, the world leader in MCUS, ships over 3.5 billion units a year, with roughly 50% of the cargo serving the automotive industry, while the rest supports industrial and things applications, as well as data centers and communications infrastructure. Renesas has the widest portfolio of 8, 16 and 32-bit devices, offering unparalleled quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience in designing smart, secure MCUs, backed by a dual-source production model, the industry's most advanced MCU process technology, and a vast network of over 250 ecosystem partners. For more information about Renesas McUS, visit Renesas.com/mcus.
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) strengthens a safer, smarter, more sustainable future where technology helps us make our lives easier. Renesas, a leading global provider of microcontrollers, combines its expertise in embedded processing, analog, power supply and connectivity to provide a complete semiconductor solution. These winning combinations will encourage time to the market for automobiles, industry, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and livelihoods. Find out more at Renesas.com. Follow us on LinkedIn and Facebook xYouTube, and Instagram.
1 EEMBC's CoreMark® benchmark measures the performance of MCUs and CPUs used in embedded systems.
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