The newly launched OSM‑LF‑IMX95 is based on NXP Semiconductors’ i.MX 95 application processor and is compliant with Open Standard Module (OSM) specification 1.2. This module is intended to provide enhanced computing performance, security, and flexibility for advanced embedded and edge AI systems despite its small footprint of 45 × 45 mm (size L).
“OSM‑LF‑IMX95 modules offer high computing performance, integrated AI and vision capabilities, and robust connectivity in a small form factor designed for direct soldering without connectors,” said Markus Mahl, senior product manager at Tria Technologies. “System architects, design engineers, and developers can benefit from the feature set of the NXP i.MX95 processor to create cost-optimized designs and accelerate time to market with ready-to-use standard modules.”
At the core of the module is a six-core Arm Cortex-A55 processor operating at up to 2 GHz, supported by two real-time processors: an 800 MHz Arm Cortex-M7 and a 333 MHz Arm Cortex-M33. Graphics and vision processing is handled by an Arm Mali GPU, a 4K video decode and encode vision processing unit, and NXP’s eIQ Neutron neural processing unit and new image signal processor. The combination is intended to support AI-powered vision tasks such as predictive maintenance, object recognition, and production line monitoring at the edge.
OSM‑LF‑IMX95 targets low-power edge platforms in industrial automation, robotics, vision systems, mobile devices, and other areas where functional safety, strong security, and high-performance connectivity are required.
Security is a key focus of modular design. It integrates NXP’s EdgeLock Secure Enclave subsystem and is designed to simplify the implementation of security-critical features such as secure boot, encryption, key management, runtime authentication, secure remote management, and over-the-air software updates. It also has a dedicated encryption engine.
Additional features include up to 16 GB of LPDDR5 SDRAM with inline error correction, up to 256 GB of eMMC flash storage, and support for a wide range of high-speed interfaces. These include SerDes with SGMII supporting up to 10G Ethernet, two Gigabit Ethernet ports, USB 3.0, and PCI Express Gen 3. The module also provides interfaces commonly used in embedded systems such as CAN-FD, dual-channel LVDS, MIPI DSI, and dual MIPI CSI-2 for camera connectivity. A QSPI interface allows connection to an external FPGA and supports onboard NOR flash.
To support evaluation and system integration, Tria Technologies offers a development platform and starter kit for OSM‑LF‑IMX95. A Yocto-based Linux board support package is available, with support for Android 12 and Windows 10 IoT Enterprise available upon request.
