2024-04-22
The award-winning on-device AI chip maker pursues key industry partnerships to strengthen this expansion. Following our strong performance at ISC West, we plan to continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024.
Taipei and Seoul, South Korea, April 23, 2024 /PRNewswire/ — DEEPX, an on-device AI semiconductor company, announces plans to expand its first-generation AI chip lineup to focus on the intelligent video analytics and security systems market. This expansion is being driven by significant business partnerships with global physical security. Enterprises, physical security device OEM/ODM, and IDH companies. To this end, the company recently opened a dedicated booth at ISC West (The International Security Conference and Exposition), the world's largest security exhibition, which will be held from April 2018. April 9th to 12th in Las Vegas, united states of americawhere we met with over 400 companies and over 600 business representatives from the world's leading security companies.
To explore partnering with DEEPX to foster synergies in the security and surveillance industry, please contact us below. info@deepx.ai
DEEPX will also have booth #123 at the Secutech exhibition in Taipei. Taiwan from April 24th to 26th Introducing innovative solutions for AI of Things (AIoT) and expanding product collaborations with physical security companies and global industrial equipment manufacturers.
The global AI video analytics market is expected to grow at a CAGR of 33% YoY. $18.11 billion By 2023 $75.35 billion This is being driven by the rapid expansion of industries applying vision AI capabilities, including smart cities and traffic management, smart factories, smart homes, retail, distribution, and healthcare.
Systems that have traditionally run AI in the cloud or on central servers have faced communication delays, privacy concerns, and network costs, and these markets are using on-device AI semiconductors to deliver real-time, intelligent video analysis capabilities. Additionally, the reorganization of the global supply chain in the physical security industry is creating an opportunity for DEEPX to accelerate the expansion of on-device AI solutions.
Taking this opportunity to empower physical security companies around the world, DEEPX's DX-M1, using 5nano processing, demonstrates overwhelming efficiency in power consumption relative to performance, compared to similar solutions in the global market. and secured a significant lead. DX-M1 supports real-time AI computing processing of over 30 frames per second (FPS) for multichannel video with over 16 channels on a single chip. Additionally, unlike other AI semiconductors, it supports a wide range of AI models, from the most popular YOLOv5 model used for object recognition to the latest YOLOv9 and Vision Transformer models.
This technological and market advantage is made possible by more than 240 patents covering fundamental technologies that ensure low manufacturing costs, low power consumption and competitive prices. These are all important factors that customers should consider when purchasing his AI semiconductors.
DEEPX is currently running an Early Engagement Customer Program (EECP) program to attract early customers and offer small camera modules with DX-V1 (5TOPS), an AI SoC solution. M.2 module with AI accelerator solution DX-M1 (25TOPS). DXNN®, a developer environment for AI server products DX-H1 quattro PCIe card (100TOPS) and DEEPX. Currently, over 100 global companies have received hardware and software from his DXNN® through this program and are using it to develop new AI-powered products for mass production.
Following its participation in ISC West and Secutech Taipei, DEEPX will be attending the Embedded Vision Summit in Silicon Valley in May and COMPUTEX 2024. Taipei In June, the company will work with local companies and global distribution organizations to accelerate global expansion.
For more information, please visit https://deepx.ai/.
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