These are the most readable items Digitime Asia Story from June 2nd to June 8th, 2025. Top highlights include ARM's entry into strategic brands and unique chip designs, Huawei's aggressive revival of R&D-driven features, and the growing momentum across Asia in AI semiconductors and advanced packaging. As the global tech giant readjusts in response to increased supply chain dynamics, export controls and open source threats, the week's top story repeats the landscape of semiconductor and systems architecture.
ARM will abolish cortical brands and bully its own chips as RISC-V fever rises
ARM Holdings is discontinuing the cortical brand and launching five new CPU lines (Nevase, Niva, Lumex, Zena, Orbis) built with CSS architectures. Rebranding is the top fourth quarter revenue of US$1 billion and is projected to exceed US$4 billion for the full year. Also, ARM is moving to chip design for the first time, with TSMC producing chips and meta among its early customers. This shift has attracted criticism from Qualcomm and is home to continued risks associated with ARM's 17% revenue exposure to China amid growing pressure from RISC-V led by Quintauris Consortium.
Wolf Speed faces uncertainty as chips slows down, and China's competition takes the prime minister's lead
WolfSpeed has denied bankruptcy rumours, but is under pressure as the US$750 million chips law grants have been delayed. Despite leading the 8-inch SIC wafer, the company has lost its position as a cheap Chinese rival, slowing demand for EVs.
Trump's previous export restrictions provided strategic leverage for Wolf Speed, but China's expansion of SIC capabilities weakened that edge. The chances of relief seem unlikely to happen, but once Trump takes office, Washington is unlikely to see Core Us Chip technology falling into foreign hands. With no clear buyers and high domestic costs, WolfSpeed options remain limited.
China's Univista launches a full stack EDA suite to overturn our control
China's Univista Industrial Software Group offers a free trial of the full stack EDA suite as US restrictions threaten access to Synopsys, Cadence and Siemens tools. Founded by former Synopsy and Cadence executives, the company has launched Univista Archer, China's first high-end, IP-owned PCB design platform for AI, 5G and automotive chips.
The company currently serves more than 200 IC design companies, has 1,100 staff (85% of technology), and is working with Empyrean Technology to promote EDA independence in China.
As ASML announces its USD 400 million chipmaking machine, TSMC is careful about high NA
TSMC is curbing the adoption of ASML's US$400 million NA EUV tools, confirming that sub-cooperative Co-Coo Kevin Zhang will not be used on future A14 or A16 nodes. Intel already has two systems installed and Samsung Electronics is committed, but TSMC aims to expand its current EUV capabilities first. Meanwhile, ASML shipped five high NA units and five more plans in 2025. They also built a training center in Arizona and prepare for the next leap (Hyper Na EUV) until the early 2030s.
Huawei rejects US sanctions with record revenue and R&D transformation
Huawei recorded its second-highest record in 2024 revenue of 86.21 billion (US$120 billion), despite a sharp increase in R&D spending ($17.7 billion, or 20% of revenue) that saw a 28% decline in net profit. The company shipped nearly 46 million smartphones in 2024, bringing back the second place in China thanks to Harmonos. While overseas growth remains limited, Huawei is expanding with wearables and connected devices as part of a broader push for technology independence.
Samsung Electro-Mechanics targets AI packages using glass substrates to compete with TSMC
Samsung Electro-Mechanics aims to start production of glass substrate samples in Sejong, South Korea by mid-2025, supplying two to three US high-tech companies. The move targets demand for AI and HPC packaging, and is part of a broader collaboration with Samsung, creating a local glass intervention supply chain. With improved heat resistance and circuit density, the glass substrate offers up to 40% chip speeds in half the power, placing Korean companies as they challenge TSMC in advanced packages.
Indian AI chip startup will win positions with veteran talent from TI, Intel and AMD, and government support
Former Intel, AMD and TI executives have launched an AI chip startup in India led by Bengaluru-based C2I semiconductors, raising USD 4 million and secured support from India's DLI scheme. Currently, Bodhi Computing, a part of Bhavish Aggarwal's Krutrim, is set to release Bodhi 1 and Bodhi 2 in 2026 by 2028.
With funding for Indian chip startups, India is bolstering its “Indian design” ambitions with a government program aimed at training 85,000 chip experts, up from USD 5 million in 2023 to over USD 28 million in 2024.
Article edited by Jerry Chen
