According to reports from wccftechquote informationMicrosoft is reportedly pushing back the AI chip roadmap, and plans to introduce temporary chips in 2027. This could be called the Maia 280.
The report cites the information and says that delays in Microsoft's Braga AI chip raised concerns about successors Braga-R and Clea facing a similar setback. These delays reportedly sparked doubts about whether Microsoft's chips could remain competitive with Nvidia's latest products.
As a result, Microsoft reportedly decided to pursue an intermediate ground solution in 2027 by launching an AI chip from a performance perspective between Braga and Braga-R. This report highlights information cited. Microsoft executives believe the new chips can deliver up to 30% performance compared to NVIDIA's expected 2027 offering, the report adds.
Based on previous reports informationMicrosoft's mass production of Braga AI chips reportedly delayed from 2025 to 2026. Tom's HardwareCiting the information, the sources show that the chip is expected to be degraded sufficiently for the performance of Nvidia's flagship Blackwell chip, which was released last year.
As pointed out by WCCFTECH, Microsoft executives will eventually manufacture hundreds of thousands of in-house AI chips each year. The report notes that increasing demand for custom chips has also driven increasing orders for chip designers such as Broadcom and Marvell, as major tech companies aim to reduce their reliance on Nvidia.
Major US CSPs accelerate AI infrastructure and in-house chip development
Trend Force Microsoft points out that while it relies primarily on NVIDIA GPU-based solutions for AI infrastructure, progress in internal ASIC development remains relatively slow. The next-generation Maia chip is expected to start rising in 2026.
Meanwhile, according to Trendforce, Meta is actively expanding both its AI server infrastructure and internal ASIC development, and it expects MTIA chip shipments to double by 2026.
Google is known for its relatively high adoption of self-developing chips, but has launched a mass deployment of its TPU V6E chips focusing on inference that became mainstream in the first half of 2025.
Trendforce emphasizes that AWS will double the shipment of self-developed ASICs in 2025 to lead US CSPs.
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(Photo credit: Microsoft)
Please note that this article quotes information. from wccftech, informationand Tom's Hardware.
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