April 9, 2024
news
Ceva, Inc. has released Ceva-Waves Links, an innovative lineup of multiprotocol wireless platform IP. These IPs are designed to support the latest wireless standards and provide enhanced connectivity capabilities for smart edge devices in consumer IoT, industrial, automotive, and personal computing. Meet the growing demand for chips.
“Ceva-Waves Links’ wireless connectivity IP builds on our extensive portfolio, which already powers more than 1 billion devices annually, and provides powerful and powerful solutions across consumer and industrial IoT applications. We have been able to establish a diverse customer base,” said Vice President Tal Shareef. General Manager of CEVA Wireless IoT BU. “With many customers designing chips that employ multiple radio standards, Links is a natural extension, leveraging our technology and expertise to significantly reduce technology barriers while delivering high performance , provide customized and optimal solutions that provide low-latency, low-power connectivity. Required.”
IP includes Wi-Fi, Bluetooth, Ultra Wide Band (UWB), and IEEE 802.15.4 (for Thread / Zigbee / Matter), each certified and integrated with optimized features provides a series of multiprotocol wireless communication subsystems that are easy to use. Supports coexistence schemes and adapts to different radios and configurations.
The Links series leverages the newly rebranded Ceva-Waves wireless connectivity IP suite (formerly RivieraWaves). At the forefront is Ceva-Waves Links100, an integrated, power-efficient communications subsystem IP tailored for IoT applications that features support for Wi-Fi 6, Bluetooth 5.4, and 802.15.4 is.
Links100 is an integrated low-power Wi-Fi/Bluetooth/15.4 communications subsystem IP for IoT applications.
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- Wi-Fi 6 optimized for cost-sensitive IoT applications,
- Bluetooth 5.4 dual mode, supports advanced Bluetooth audio with Auracast and comprehensive Bluetooth profile suite
- IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home applications
- Optimized coexistence scheme for efficient concurrent communication
- Pre-integrated low-power multiprotocol radio on TSMC 22nm process
- Advanced Wi-Fi 6/6E/7 with MLO for a variety of use cases, from power-efficient IoT to high-speed data streaming
- Channel sounding and high data overall with next generation Bluetooth
- Supports UWB, FiRa 2.0, CCC Digital Key 3.0, and Radar for innovative microlocation and sensing capabilities
- Coexistence scheme optimized for each specific configuration
- Pre-integrated wireless solutions, including partner and customer proprietary technologies, support a wide range of configurations and foundry process nodes
“Wireless connectivity chips are increasingly required to support multiple standards to meet the evolving needs and diverse use cases of consumer and industrial devices. It provides a significant value proposition for OEMs, reducing the risk and investment required to integrate multi-protocol wireless connectivity into chip designs. Additionally, support for UWB makes the Links family a truly advanced smart edge device. “We provide innovative microlocation and radar sensing capabilities for the industry,” said Andrew Zignani, Senior Research Director at ABI Research.
For more information, please visit ceva-ip.com.
Chad Cox. The Embedded Computing Design Production Editor's responsibilities include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a BA in Cultural and Analytical Literature.
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